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High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
Bias Resistor
Bias current for the LO buffer is optimized by fine tun-
ing resistor R1. If reduced current is required at the
expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground-pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal con-
duction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX2032 evaluation kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maxim-ic.com .
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin with
the capacitors shown in the Typical Application Circuit.
See Table 1.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX2032’s 20-pin thin
QFN-EP package provides a low-thermal-resistance
path to the die. It is important that the PCB on which the
MAX2032 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a low-
inductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
18
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